Smaller FPGAs mean less power

The parts are the MPF050T FPGA and MPFS025T SoC, both available in 11 x 11mm packaging.We have reduced power consumption by up to 50% or more with the introduction of lower density offerings, while maintaining capabilities on these platforms, said Microch

Sponsored Content: Getting ESD protection right for CAN-FD

The expectations of travel and human interaction with vehicles is changing dramatically. As such, mega trends of increased connectivity, autonomous driving and electrification are pushing the evolution of automotive wiring harnesses and driving the growin

Nvidia announces pricing, NA availability for Base Command AI dev hub

Nvidia Base Command Platform, a hosted AI development hub, is now available in North America with monthly pricing starting at $90,000 with a three-month minimum, the company announced Monday.It offers a single pane of glass for work groups to accelerate A

What is a chip inductor?

An inductor is one of the three passive circuit elements used in electronics. All three passive elements, including resistors and capacitors, are all available in chip form. As every introductory class on electrical engineering teaches, inductors are typi

Bourns IsoMOV protectors redefine MOV protection technology

Bourns has developed a new hybrid MOV protection device that integrates the GDT function in the MOV, delivering higher surge ratings in smaller packages.Bourns, Inc. has claimed one of the most significant breakthroughs in metal oxide varistor (MOV) devic

Will ToF sensors come standard on smartphones?

Getting consumers eager to own smartphones with ToF sensors starts by helping them understand the benefits.Design engineers must stay abreast of the latest smartphone features and technologies to understand what’s likely on the horizon. Which offeri

Loongson releases the first independent architecture CPU, performance soars by 50%

Recently, Loongson Zhongke announced the official release of the Loongson 3A5000 processor. This product is the first processor chip that uses the autonomous command system LoongArch, and its performance has achieved a significant leap. This product also

AMD or willfully embrace HBM, both CPU and GPU will be used?

Recently, rumors broke out on the Internet that AMD’s next-generation Zen 4-core EPYC Genoa processor may be equipped with HBM content in order to compete with Intel’s next-generation server CPU Xeon Sapphire Rapids. Coincidentally, the recent

ON Semiconductor's intelligent perception technology empowers the 360-degree vision of AutoX's fifth-generation driverless system

28 2D image sensors and 4 3D lidar sensors eliminate blind spots and ensure the highest level of safety.July 15, 2021-ON Semiconductor (ON Semiconductor, NASDAQ: ON) today announced that its image sensing and lidar (LiDAR) technology empowers AutoX's

Atonarp announces the launch of Aston, an innovative metrology platform designed to improve the yield, throughput, and efficiency of semiconductor manufacturing processes

July 16, 2021-Atonarp, a leading manufacturer of molecular sensing and diagnostic products for the semiconductor, healthcare, and pharmaceutical industries, today announced the launch of Aston, an innovative in-situ semiconductor metrology platform with a

Ruisi Zhixin completes nearly 100 million yuan of Pre-A round of financing, focusing on a new generation of machine vision technology

On July 7th, Beijing Ruisi Zhixin Technology Co., Ltd. (referred to as "Ruisi Zhixin") has completed nearly 100 million yuan of Pre-A round of financing, jointly led by Hikvision and Yaotu Capital, iFLYTEK Venture Capital, Sunny Central Research Institute

The birth of China's largest computing chip! Suiyuan Technology releases Yunsi 2.0 AI training chip

Suiyuan Technology released the second generation of artificial intelligence training products in Shanghai on July 7th-"Yunsi 2.0" chip, "Yunsui T20" training accelerator card based on Yunsi 2.0 and "Yunsui T21" training OAM module, The fully upgraded "To

Chinese Academy of Sciences releases domestic open-source high-performance RISC-V processor "Xiangshan"

On the morning of June 22-25, the first RISC-V China Summit was held at ShanghaiTech University. At this conference, Bao Yungang, a professor at the University of Chinese Academy of Sciences and a researcher at the Institute of Computing Technology of the

Renesas Electronics launches R-Car Gen3e for in-vehicle infotainment, smart cockpit, and digital instrument panel systems, with a 20% increase in CPU speed

The new SoC brings 2GHz speed, higher application integration, and stronger functional safety to a wide range of applications from entry to mid-range, as well as excellent scalability and software reuse of R-Car Gen3Tokyo, Japan, July 20, 2021-Renesas Ele

FAULHABER launched two new motion controllers of the MC 3001 series with powerful power and small size

MC3001 series motion controllers have two models: MC 3001 B (board-to-board connector) and MC3001P (28-pin plug connector), which make up for the defects of FAULHABER MC V3.0 version controller products in the low-end performance field. This type of contr

ADLINK Technology Launches New EtherCAT Module to Provide Complete EtherCAT Solution for Industrial Automation

Summary:· ADLINK Technology has a complete EtherCAT solution, with both master and slave modules, which can provide an ideal cost-effective combination·In test applications, the EtherCAT system can save up to 10% of the total cost of ownersh

Tesla tests the new version of FSD, and the visualization is fully enhanced

On July 9, Tesla officially pushed the FSD Beta 9 update to car owners who successfully applied for the test program. Although Tesla's FSD focuses on fully autonomous driving capabilities, it is still an assisted driving system. In the future, it will

RF chip companies are intensively listed!

A number of RF front-end chip manufacturers are smoothly advancing their listings. The application for listing on the Sci-tech Innovation Board has been accepted by Haoda Electronics and Weijie Chuangxin. The A-share listing of Feixiang Technology has bee

New breakthrough in semiconductor thick metal technology! One million times smaller than traditional casting, to achieve wafer-level complex metal structure casting

Recently, Maizhu Semiconductor, a startup company dedicated to the R&D and industrialization of wafer-level MEMS-Casting™ technology, successfully developed a miniature U-shaped electromagnet, an electromagnet target smaller than a fingertip It has

NVIDIA officially released the UK’s strongest supercomputer "Cambridge One"

On July 7th, NVIDIA announced that it has officially launched the UK’s strongest supercomputer "Cambridge-1" (Cambridge One), which is mainly used for medical and health research in the United Kingdom. This is also the first dedicated computer that

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